D1430

The D1430 is a linear air bearing specifically designed to operate in a very vacuum environment, such as in a wafer ion inplantation chamber. The linear stroke length can be up to 508mm in a vertical orientation, and rotation is also possible. The wafer chuck can be attached at one end of the hollow shaft and a linear motor to the other end.

Specifications of D1430

Stroke lengthsup to 508mm (for vertical operation)
Shaft rotation0 to 360 degrees
Bearing air pressure5.6 kg/cm*2
Shaft diametersup to 85mm
Body diametersup to 200mm
Moment load (typical)79 Nm
Vacuum sealsNon-contacting
Application Up to 300mm dia. wafers

D1591

The D1591 is a heavy-duty wafer dicing spindle with a maximum speed of 30,000rpm, specifically designed for the dicing of hard semiconductor materials. Suitable for saw blade diameters up to 4”, the spindle is fitted with a powerful DC motor, front thrust bearing system and a customised wheelmount design. 

Specifications of D1591 dicing spindle

Speed range 5000 - 30,000 rpm 
Motor output power 2.5 kW @ 12,000 rpm 
Bearing air pressure 5.6 kg/cm*2 
Bearing air consumption 81 nl/min 
Cooling water flowrate 2.1 l/min 
Shaft centreline-to-body flat dimension 44.4 mm 
Typical blade size 100mm 

M290

The M290 is a large wafer grinding spindle with a maximum speed of 15,000rpm, used for grinding the faces of 200mm and 300mm diameter wafers. Fitted with a powerful direct drive AC motor, it can be flange mounted for easy installation. Options include through-shaft coolant, speed sensor and customised wheelmounts.

Specifications of M290 wafer grinding spindle

Speed range 1500 –15,000 rpm
Motor power 4 kW @ 4000 rpm 
Axial stiffness 17.8 kg/micron  
Axial load 249 kg 
Radial stiffness (at nose) 4.45 kg/micron  
Radial load (at nose) 90 kg 
Bearing air pressure 5.6 kg/cm*2 
Bearing air consumption 232 nl/min 
Water cooling flowrate 0.75 - 1.9 l/min 
Axial runout < 0.1 microns 
Overall length 796 mm