The D1591 is a heavy-duty wafer dicing spindle with a maximum speed of 30,000rpm, specifically designed for the dicing of hard semiconductor materials. Suitable for saw blade diameters up to 4”, the spindle is fitted with a powerful DC motor, front thrust bearing system and a customised wheelmount design.
| Speed range | 5000 - 30,000 rpm |
| Motor output power | 2.5 kW @ 12,000 rpm |
| Bearing air pressure | 5.6 kg/cm*2 |
| Bearing air consumption | 81 nl/min |
| Cooling water flowrate | 2.1 l/min |
| Shaft centreline-to-body flat dimension | 44.4 mm |
| Typical blade size | 100mm |
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