The D1591 is a heavy-duty wafer dicing spindle with a maximum speed of 30,000rpm, specifically designed for the dicing of hard semiconductor materials. Suitable for saw blade diameters up to 4”, the spindle is fitted with a powerful DC motor, front thrust bearing system and a customised wheelmount design. 

Specifications of D1591 dicing spindle

Speed range 5000 - 30,000 rpm 
Motor output power 2.5 kW @ 12,000 rpm 
Bearing air pressure 5.6 kg/cm*2 
Bearing air consumption 81 nl/min 
Cooling water flowrate 2.1 l/min 
Shaft centreline-to-body flat dimension 44.4 mm 
Typical blade size 100mm