The D1592 is a high speed wafer dicing spindle with a maximum speed of 60,000rpm, specifically designed for the dicing of silicon wafers of up to 300mm diameter. Suitable for saw blade diameters up to 2”, the spindle is fitted with a powerful DC motor, front thrust bearing system and a customised wheelmount design.

Specifications of D1592 dicing spindle

Speed range30,000 - 60,000 rpm
Motor output power1.2kW @ 60,000 rpm
Bearing air pressure5.6 kg/cm*2
Bearing air consumption65 nl/min
Cooling water flowrate1.4 l/min
Shaft centreline-to-body flat dimension23 mm
Typical blade size100mm