The D1592 is a high speed wafer dicing spindle with a maximum speed of 60,000rpm, specifically designed for the dicing of silicon wafers of up to 300mm diameter. Suitable for saw blade diameters up to 2”, the spindle is fitted with a powerful DC motor, front thrust bearing system and a customised wheelmount design.
| Speed range | 30,000 - 60,000 rpm |
| Motor output power | 1.2kW @ 60,000 rpm |
| Bearing air pressure | 5.6 kg/cm*2 |
| Bearing air consumption | 65 nl/min |
| Cooling water flowrate | 1.4 l/min |
| Shaft centreline-to-body flat dimension | 23 mm |
| Typical blade size | 100mm |
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