Westwind products have played a major role in the development of semiconductor wafer processing air bearing spindles for over 40 years, specifically developing industry standard machining spindles for high speed dicing, grinding, and edge grinding of silicon and hard material wafers. Additionally, we have developed a range of world-leading linear air bearings, used to move the wafer through the ion beam in a high vacuum chamber for the ion implantation process. Air bearing spindles are ideally suited for semiconductor processing applications due to their oil-free operation, ultra-smooth precise motion, and very low vibration. This ensures that the surface finish and edge quality achieved are to the highest quality standards. 

Core benefits of the product range: 

Westwind Semiconductor Wafer Processing Spindles